MAJOR EVENTS

• 1982 Start of mass production of Thick Film Circuits
• 1983 Multilayer ceramic substrates
• 1985 Surface Mounting Production line
• 1989 Introduction of a line of proprietary Sensors
• 1989 Chip & Wire assembly process
• 1990 New 2500 m² facility with 280 m² of clean room
• 1992 High speed SMT production line
• 1992 CAD system
• 1993 Chip On Board assembly process
• 1995 MCM - Ceramic Multilayer Transfer-Tape technology
• 1995 Fine-Pitch SMT assembly line
• 1995 UNI EN ISO 9002 certification
• 1996 LTCC Ceramic Multilayer technology in cooperation with Siegert Electronic GmbH
• 1998 Establishment of VIA electronic GmbH to manufacture 8"x8" LTCC substrates
• 1998 Microwave modules assembly line in compliance with the NATO AQAP120 requirements

MICROTEL tecnologie elettroniche S.p.A.