CURRENT
DEVELOPMENT ACTIVITIES
- Automatic
ball bonding on ceramics and organic substrate (FR4) (1)
- SM
of high volumes flip chips with optical pattern
recognition (1)
- Automatic US wedge bonding
for power devices with heavy wires(1)
- Characterization of
production processes using DOE and SPC tools to reach the
Six-Sigma quality level(1)
- ©DECCO (Demonstration of EConomic and
reliable manufacturing processes for multichip modules
using innovative COfiring ceramics), Innovation Programme(1)
- HIDENIMP
(HIgh DENsity connection IMPlementation), Craft Program(1)
- ECONOX II
(Gas sensor and associated signal processing for
automotive exhaust pipe), BRITE Program(2)
- IISME (Internet and Intranet based
Sales and Marketing support system for small and medium
Enterprises), Esprit Program(1)
- COMPETE (CO-ordination of
Microelectronics Packaging & interconnection projects:
Environment and Trends for the development of European
solution), supported by DGXIIC(1)
Contact Point:
(1) Dr.
Francesco Massari
(2) Dr. Antonio Tersalvi
MICROTEL tecnologie elettroniche S.p.A.
