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Fabrication and characterization of
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List of Figures
Contents
List of Tables
2.1.
Parameter conversion table.
6.1.
Ohmic contacts for different processed wafers
6.2.
Peak current densities in the forward and reverse direction for different Al concentrations in the injector.
6.3.
Negative conductance minima for diodes with different active region lengths and areas.
B.1.
Properties of semiconductors at room temperature.
simone montanari 2005-08-02
