ABBREVIAZIONI TECNICHE
© by Vittorio Crapella
| AAC = Advanced Audio Coding |
| AMR = Automatic meter reading |
| AOI = Automated Optical Inspection |
| ASIC = Application Specific Integrated Circuits |
| ATSC = Advanced Television System Committee |
| AXI = Automated X-ray Inspection |
| BER = Bit Error Rate |
| BTS = Base Transiver Station |
| BWA = Boardband Wireless Access |
| CCFT = Cold Cathode Florescent Tubes |
| CEM = Contract Electronics Manufacturing |
| CETRA = China External Trade Development Council |
| CFC = Current Flux Control |
| CFI = Common Flash Interface |
| CODFDM = Coded Orthogonal Frequency Division |
| CPLD = Complex Programmable Gate Array |
| CPS = Chip Scale Package |
| CRU = Clock Recovery Unit |
| CSoC = Configurable System on Chip |
| CSP = Chip Scale Package |
| DDR = Dual Data Rate |
| DDS = Direct Digital Synthesis |
| DFT = Diagnostic Fault Test |
| DIVA = Dynamic Internet Voice Access |
| DOCSIS = Data Over Cable Service Interface Specification |
| DSL = Digital Subscriber Line |
| DTT = Digital Terrestrial Television |
| EKE = Exstended Kalman Estimator |
| EMI = ElectroMagnetic Interference |
| EMI = Electronics Manufacturing International |
| EMT = Electronic Manufacturing Technology |
| EMT = Electronics Manufacturing Technology |
| EPB = Ether Plan Backplane |
| EPTFE = Explanet polytetrafluoroethylene |
| ESAN = Embedded System Area Network |
| ESD = ElectroStatic Discharge |
| ETSI = European Telecommunication Standards Industry's |
| FEC = Forward Error Correction |
| FIPO = Field Instantly Programmable Oscillator |
| FIR = Focused Infra-Red |
| FMEA = Failure Mode Effect Analysis |
| FPC = Flexible Printed Circuit |
| FPGA = Field Programmable Gate Array |
| FRAM = Ferroelectric Random Access Memory |
| FT = Functional Tester |
| GFD = Ground Fault Detector |
| GPRS = Digital Packet Service |
| HID = Human Interface Divices |
| HTCC = High Temperature C0-fired Ceramic |
| IAD = Integrated Access Device |
| IAP = In Application Programming |
| ICT = In-Circuit Tester |
| ISDB = Integrated Service Digital Broadcasting |
| ISM = Industrial Scientific Medical |
| ISP = In System Programming |
| ISP = Internet Service provider |
| JCAE = Java Card Application Environment |
| JCVM = Java Card Virtual Machine |
| JEIDA = Japanese Electronic Industry Association |
| JTAG = Joint Test Action Group |
| KOCAP = Kermet Organic Capacitor |
| LCM = Light Control Module |
| LDO = Low Drop Out |
| LEC = Local Exchange Carrier |
| LFBGA = Low-Profile Fine-Pitch Ball Grid Array |
| LTCC = Low Temperature C0-fired Ceramic |
| LTCC = Low Temperature Cofired Ceramic |
| LVDS = Low Differential Signal |
| MAFE = Modem Analog Front End |
| MEMS = Micro Electro Mechanical System |
| MIPS = Million Instructions Per Second |
| MLCC = Multi Layer Ceramic Capacitor |
| MLF = Micro Lead Frame |
| MLP = Meridian Lossless Packing |
| MLS = Multi Line Scan |
| MMICs = Monolithic Microwave Integrated Circuits |
| MOEMS = Micro Opto Electro Mechanical System |
| NFI = Near Filed Imaging |
| OADM = Optical Add/Drop Multiplexer |
| OCC = Optical Cross Connects |
| OCLP = Over Current Latch up Protection |
| OCP = Over Current Protection |
| OEM = Original Equipment Manufacturer |
| OLED = Organic Light Emitting Diode |
| OLP = Over Load Protection |
| OSC = Office Systems Consulting |
| OVP = Over Voltage Protection |
| PAD = Personal Access Device |
| PCS = Personal Communication System |
| PDM = Product Data Management |
| PFC = Power Factor Correction |
| PIN = Positive Intrinsic Negative |
| PPTC = Polymeric Positive Temperature Coefficient |
| PSP = Parallel Signal Processing |
| PSRR = Power Supply Rejection Ratio |
| PWM = Pulse Width Modulation |
| PZT = Lead Zirconate Titanate |
| QoS = Quality of Service |
| RAD = Rapporto di Assorbimento Dielectrico |
| RCD = Residual Current Device |
| REC = Reed Exhibition Companies |
| RTOS = Real Time Operating System |
| RTV = Real Time Vision |
| SAR = Specific Absorption Rate |
| SAR = Successive Approximation Register |
| SAW = Surface Acoustic Wave |
| SEPIC = Single-End Primary Inductance Converter |
| SERA = Sequential Electrochemical Reduction Analysis |
| SFF = Small Form Factor |
| SLC = Surface Laminar Circuit |
| SOA = Safe Operating Area |
| SOI = Silicon On Isolator |
| SOPC = System On Programmable Chip |
| SPACE = Surface Process Assembly Cost Estimator |
| SPD = Single Polarizer Display |
| SPOT = Smart Platform Operator Terminal |
| SST = Spread Spectrum Timing |
| TCR = Temperature Coefficient of Resistance |
| TCXO = Temperature Compensate Crystal Oscillators |
| THD = Total Harmonic Distortion |
| THR = Thrue Hole Reflow |
| TIA = Totally Integrated Automation |
| TOC = The Theory of Constraints |
| TOC = Typical Operating Caracteristics |
| TRM = Temper Resistant Module |
| TVS = Transient Voltage Suppression |
| UMS = United Monolithic Semiconductor |
| UMTS = Universal Mobile Telecommunication System |
| VCSL = Vertical Cavity Surface Emitting Laser |
| VFC = Voltage Fluxe Control |
| VFD = Vacuum Fluorescent Display |
| VLIW = Velocity Long Instruction Word |
| VON = Voice Over Networks |
| VPN = Virtual Private network |
| VSWR = Voltage Standing Wave Radio |
| WAN = Wide Area Network |
| WEEE = Waste European Electrical Electronic Equipment |
| WIAs = Wirless Internet Appliances |
| WRAP = Web Ready Appliances Protocol |